Rohit Gandhi
Mechanical engineering
Hometown: Pune, Maharashtra, India
Graduation date: Spring 2024
Additional details: First-generation college student
MORE | Spring 2024
Thermal Management for 3D Heterogenous Integration of Semiconductor Packaging
The growing demand for advanced computing is undeniable, leading to increased power requirements for computer chips. Consequently, the generated heat from these components is also on the rise. This study focuses on developing an innovative intralayer cooling system for future 3D integrated semiconductor packages. Specifically, a liquid-cooled micro-pin fin heat sink is designed and analyzed to tackle high heat flux and localized hot spots in high-power microsystems. Through numerical simulations and preliminary experimental assessments, the effectiveness of this cooling solution is evaluated. The goal is to gain insights and pave the way for the next generation of microelectronic cooling systems that can efficiently manage thermal challenges in complex and high-performance devices.
Mentor: Robert Wang
It’s hip to be square.
Students presenting projects at the Fulton Forge Student Research Expo are encouraged to download this personal QR code and include it within your poster. This allows expo attendees to explore more about your project and about you in the future.
Right click the image to save it to your computer.