William Boutin
Mechanical engineering
Hometown: Merritt Island, Florida, United States
Graduation date: Fall 2024
FURI | Summer 2024, Needs Review
Flat Punch vs Spherical Indenter Probes for Fracture Testing of GaAs Single Crystals Utilized in Microelectronics and Semiconductor Industries
The increasing demand for microelectronics necessitates standardized materials testing techniques at small length scales. While advancements have been made in material testing at the micro-scale, there are still gaps to be addressed, partly due to the complexities involved, such as specimen manufacturing, indenter probe misalignment, and crack length definition. Accurately characterizing material properties of gallium arsenide (GaAs) and other microelectronic and semiconductor materials using nanoindentation is crucial for advancing damage-tolerant design in the electronics, medical, and transportation industries.
Mentor: Masoud Yekani Fard
It’s hip to be square.
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